Print head and image forming apparatus

ABSTRACT

A print head includes: a mounting board; a light source portion that includes a plurality of light emitting elements provided on one surface of the mounting board; a drive member that is provided on other surface of the mounting board so as to generate a lighting signal and drive the light source portion; and a first temperature detector that is provided on the mounting board, and at least one second temperature detector that is provided at a farther position on the mounting board from the drive member than the first temperature detector; and the drive member includes: a light emitting unit that generates the lighting signal based on a temperature detected by the first temperature detector and a temperature detected by the second temperature detector; and an optical unit that forms an image of light emitted from the light emitting unit.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is based on and claims priority under 35 USC 119 fromJapanese Patent Application No. 2016-124137 filed on Jun. 23, 2016.

BACKGROUND Technical Field

The present invention relates to a print head and an image formingapparatus.

SUMMARY

According to an aspect of the invention, there is provided a print headcomprising: a mounting board; a light source portion that includesplural light emitting elements provided on one surface of the mountingboard; a drive member that is provided on the other surface of themounting board so as to generate a lighting signal and drive the lightsource portion; and a first temperature detector that is provided on themounting board, and at least one second temperature detector that isprovided at a farther position on the mounting board from the drivemember than the first temperature detector; wherein the drive memberincludes: a light emitting unit that generates the lighting signal basedon a temperature detected by the first temperature detector and atemperature detected by the second temperature detector; and an opticalunit that forms an image of light emitted from the light emitting unit.

BRIEF DESCRIPTION OF THE DRAWINGS

Exemplary embodiments of the present invention will be described indetail based on the following figures, wherein:

FIG. 1 is a view showing an example of the total configuration of animage forming apparatus to which an exemplary embodiment of theinvention is applied;

FIG. 2 is a sectional view showing an example of the configuration of aprint head;

FIGS. 3A and 3B are plan views of a light emitting device, FIG. 3A is aplan view in one surface of the light emitting device, and FIG. 3B is aplan view in the other surface of the light emitting device;

FIGS. 4A and 4B are diagrams showing the configuration of each lightemitting chip and the configuration of the light emitting device, FIG.4A shows the configuration of the light emitting chip, and FIG. 4B showsthe configuration of a drive circuit of the light emitting device andthe configuration of wirings (lines) on a mounting board;

FIG. 5 is an equivalent circuit diagram for explaining the circuitconfiguration of the light emitting chip mounted with a self-scanninglight emitting element array (SLED);

FIG. 6 is a timing chart for explaining the operation of the lightemitting device and the light emitting chip;

FIG. 7 is a graph showing an example of fluctuation in emission amount(reduction in emission amount) caused by a temperature difference amonglight emitting thyristors in the print head;

FIG. 8 is a diagram for explaining the configuration of a lightingsignal generating portion in the drive circuit;

FIG. 9 is a graph for explaining the relationship between the resistancevalue of a thermistor and the temperature;

FIGS. 10A and 10B are graphs showing the relationship between the ratio(resistance value ratio) between the resistance value of a referenceresistor and the resistance value of a thermistor, and the temperature,FIG. 10A shows the relationship between the resistance value ratio andthe temperature, and FIG. 10B shows a look-up table (LUT) stored ascorrection values B in a correction value B memory; and

FIG. 11 is a graph showing the relationship among a correction value A,a correction value B, and an actual correction value.

DESCRIPTION OF REFERENCE NUMERALS AND SIGNS

1 . . . image forming apparatus, 10 . . . image forming process portion,11,11Y,11M,11C,11K . . . image forming unit, 12 . . . photoreceptordrum, 14 . . . print head, 30 . . . image forming controller, 40 . . .image processing portion, 62 . . . mounting board, 63 . . . light sourceportion, 64 . . . rod lens array, 65 . . . light emitting device, 101 .. . transfer portion, 102 . . . light emitting portion, 110 . . . drivecircuit, 120 . . . transfer signal generating portion, 140 . . .lighting signal generating portion, 141 . . . serial communicationportion, 142 . . . correction value A memory, 143 . . . correction valueB memory, 144 . . . correction value computing portion, 145 . . .temperature measuring portion, 146 . . . lighting period calculatingportion, 147 . . . lighting signal output portion, 148 . . . nonvolatilememory, 160 . . . reference potential supply portion, 170 . . . powersupply potential supply portion, φ1 . . . first transfer signal, φ2 . .. second transfer signal, φI(φI1-φI40) . . . lighting signal, C(C1-C40). . . light emitting chips, L . . . light emitting thyristor, T . . .transfer thyristor, Dx . . . coupling diode, Vga . . . power supplypotential, Vsub . . . reference potential

DETAILED DESCRIPTION

In an image forming apparatus using an electrophotographic system, suchas a printer, a copying machine or a facsimile machine, an image isformed in the following manner. That is, a photoreceptor which has beencharged is irradiated with image information by an optical recordingunit to obtain an electrostatic latent image. After that, toner isapplied to the electrostatic latent image, and an image visualized thusis transferred onto recording paper and fixed thereto. As such anoptical recording unit, a recording apparatus using an optical scanningsystem in which a laser is used for exposure with a laser beam scanningin a main scanning direction. In addition, in recent years, a recordingapparatus using an LPH (LED Print Head) has been used in response to arequest for miniaturization of the apparatus. In the LPH, plural lightemitting elements such as LEDs (Light Emitting Diodes) are arrayed in amain scanning direction as a light source portion.

An exemplary embodiment of the invention will be described below withreference to the accompanying drawings.

(Image Forming Apparatus 1)

FIG. 1 is a view showing an example of the total configuration of animage forming apparatus 1 to which the exemplary embodiment is applied.The image forming apparatus 1 shown in FIG. 1 is a so-called tandem typeimage forming apparatus. The image forming apparatus 1 has an imageforming process portion 10, an image forming controller 30, and an imageprocessing portion 40. In the image forming process portion 10, an imageis formed in accordance with image data for each color. The imageforming controller 30 controls the image forming process portion 10. Theimage processing portion 40 is, for example, connected to a PC (PersonalComputer) 2 or an image reading apparatus 3. The image processingportion 40 performs predetermined image processing on image datareceived from the PC 2 or the image reading apparatus 3.

The image forming process portion 10 has four image forming units 11Y,11M, 11C and 11K disposed in parallel and at predetermined intervals.Each image forming unit 11Y, 11M, 11C, 11K has a photoreceptor drum 12,a charger 13, a print head 14, and a developing device 15. Thephotoreceptor drum 12 is an example of an image holder for forming anelectrostatic latent image and holding a toner image. The charger 13 isan example of a charging unit for charging the surface of thephotoreceptor drum 12 with predetermined potential. The print head 14performs exposure on the photoreceptor drum 12 charged by the charger13. The developing device 15 is an example of a developing unit fordeveloping the electrostatic latent image obtained by the print head 14.The image forming units 11Y, 11M, 11C and 11K form toner images ofyellow (Y), magenta (M), cyan (C) and black (K) respectively.Incidentally, the image forming units 11Y, 11M, 11C and 11K may bedesignated as image forming units 11 without being individuallydistinguished.

In addition, the image forming process portion 10 are provided with apaper conveyance belt 21, drive rolls 22, transfer rolls 23 and a fixingdevice 24 so that toner images of the respective colors formed on thephotoreceptor drums 12 of the image forming units 11Y, 11M, 11C and 11Krespectively can be multi-transferred to recording paper 25. Therecording paper 25 is an example of a body to be transferred. The paperconveyance belt 21 conveys the recording paper 25. The drive rolls 22drive the paper conveyance belt 21. The transfer rolls 23 form anexample of a transfer unit by which toner images on the photoreceptordrums 12 are transferred to the recording paper. The fixing device 24fixes the toner images to the recording paper 25.

In the image forming apparatus 1, the image forming process portion 10carries out an image forming operation based on various control signalssupplied from the image forming controller 30. Under the control of theimage forming controller 30, the image processing portion 40 carries outimage processing on image data received from the personal computer (PC)2 or the image reading apparatus 3, and supplies the processed imagedata to the image forming units 11. For example, in the image formingunit 11K for black (K), the photoreceptor drum 12 rotating in thedirection of the arrow A is charged to predetermined potential by thecharger 13, and exposed to light by the print head 14. The print head 14is an example of an exposure unit, which emits light based on the imagedata supplied from the image processing portion 40. Thus, anelectrostatic latent image for a black (K) image is formed on thephotoreceptor drum 12. The electrostatic latent image formed on thephotoreceptor drum 12 is developed by the developing device 15, and atoner image of black (K) is formed on the photoreceptor drum 12. Also inthe image forming units 11Y, 11M and 11C, toner images of yellow (Y),magenta (M) and cyan (C) are formed respectively.

Due to transfer electric fields applied to the transfer rolls 23, thetoner images of the respective colors formed on the photoreceptor drums12 by the image forming units 11 respectively are electrostaticallytransferred sequentially onto the recording paper 25 supplied with themovement of the paper conveyance belt 21 moving in the direction of thearrow B. Thus, a composite toner image in which toners of the respectivecolors have been superimposed is formed on the recording paper 25.

After that, the recording paper 25 to which the composite toner imagehas been electrostatically transferred is conveyed to the fixing device24. The composite toner image on the recording paper 25 conveyed to thefixing device 24 is fixed onto the recording paper 25 due to fixingprocessing by heat and pressure in the fixing device 24. The recordingpaper 25 is then discharged from the image forming apparatus 1.

(Print Head 14)

FIG. 2 is a sectional view showing an example of the configuration ofthe print head 14. The print head 14 has a housing 61, a light emittingdevice 65, a rod lens array 64, and a reinforcing member 66. The lightemitting device 65 is provided with a light source portion 63 includingplural light emitting elements (light emitting thyristors as examples oflight emitting elements in the exemplary embodiment) exposing thephotoconductor drum 12 to light. The rod lens array 64 is an example ofan optical unit by which an image can be formed on the surface of thephotoreceptor drum 12 due to the light emitted from the light sourceportion 63. The reinforcing member 66 reinforces the mechanicalstrength.

The light emitting device 65 has a mounting board 62. The aforementionedlight source portion 63 is provided on one surface (hereinafter referredto as front surface) of the mounting board 62. On the other hand, adrive circuit 110 for driving the light source portion 63, andthermistors 111 and 112 (designated as 111/112 in FIG. 2) for detectingthe temperature of the mounting board 62 are provided on the othersurface (hereinafter referred to as back surface) of the mounting board62.

The light emitting device 65 will be described in detail later.

The housing 61 is, for example, formed out of metal. The housing 61 isset to support the mounting board 62 and the rod lens array 64 so thatthe light emitting surfaces of the light emitting elements in the lightsource portion 63 can be located in the focal plane of the rod lensarray 64. In addition, the rod lens array 64 is disposed along the axialdirection (a main scanning direction designated by the X-direction inFIGS. 3A-3B and FIG. 4B, which will be described later) of thephotoreceptor drum 12.

The reinforcing member 66 is, for example, formed out of a metal plate.

(Light Emitting Device 65)

FIGS. 3A and 3B are plan views of the light emitting device 65. FIG. 3Ais a plan view in one surface of the light emitting device 65, and FIG.3B is a plan view in the other surface of the light emitting device 65.Incidentally, the light emitting device 65 is an example of a lightemitting unit.

In the light emitting device 65 shown in FIGS. 3A and 3B by way ofexample, the light source portion 63 includes forty light emitting chipsC1-C40 on the surface of the mounting board 62. The light emitting chipsC1-C40 are arranged into two lines extending in the X-direction as themain scanning direction and in a zigzag manner. Incidentally, the lightemitting chips C1-C40 are mounted in a central portion of the mountingboard 62 so as not to deflect in one end portion in the longitudinaldirection of the mounting board 62. In this manner, the longitudinallength of the mounting board 62, that is, the light emitting device 65can be reduced. The arrangement of the light emitting chips C1-C40 willbe described in detail later.

In the present specification, “-” designates plural constituent elementsdistinguished individually by their numbers, and means that two elementsbefore and behind “-” and elements corresponding to numbers between thenumbers of the two elements are included. For example, the lightemitting chips C1-C40 include elements from the light emitting chip C1to the light emitting chip C40 in numerical order.

The light emitting chips C1-C40 have one and the same configuration.Therefore, the light emitting chips C1-C40 will be referred to as lightemitting chips C when they are not distinguished individually.

Incidentally, the exemplary embodiment will be described on theassumption that the total number of light emitting chips C is 40, butthe invention is not limited thereto.

In the light emitting device 65, the drive circuit 110 for driving thelight source portion 63 is mounted on the back surface of the mountingboard 62.

Further, the light emitting device 65 has the thermistor 111 near thedrive circuit 110, and the thermistor 112 in an end portion of themounting board 62 away from the drive circuit 110. The thermistors 111and 112 detect the temperature of the mounting board 62. The thermistor111 is an example of a first temperature detector, and the thermistor112 is an example of a second temperature detector. That is, the secondtemperature detector is provided in a farther position from the drivecircuit 110 than the first temperature detector. Incidentally, two ormore second temperature detectors may be provided.

Incidentally, other temperature detectors such as thermocouples may beused in place of the thermistors 111 and 112.

The mounting board 62 is a PCS (Printed Circuit Board) using aninsulating material such as a glass epoxy material as a substrate.Wirings (lines) made of a conductive material such as copper (Cu) areformed in the front and back surfaces of the mounting board 62. Thewiring in the front surface and the wiring in the back surface areconnected by a conductive material through through-holes or the likeprovided in the substrate.

The drive circuit 110 is, for example, constituted by an ASIC(Application Specific Integrated Circuit) or the like. That is, thedrive circuit 110 is an IC chip. The drive circuit 110 may beconstituted by plural IC chips. Further, resistors, capacitors, etc. maybe provided around the drive circuit 110. Here, there is a case where acomponent largest in heat generation or a group of plural componentsincluding the component largest in heat generation and componentsprovided around the largest component may be designated as drivemembers. Examples of the drive members include an IC chip mounted withthe drive circuit 110, and a chip group including resistor chips,capacitor chips, etc. provided around the IC chip.

Here, the drive circuit 110 is provided just behind the light sourceportion 63. “Just behind the light source portion 63” means that atleast a part of the drive circuit 110 overlaps with a projected image ofthe light source portion 63 when the light source 63 is projected on theback surface of the mounting board 62. Incidentally, the drive circuit110 may be provided in a position deviated from the position just behindthe light source portion 63.

The drive circuit 110 is provided in a central portion (the partcorresponding to the light emitting chips C20 and C21) of the array ofthe light emitting chips C1-C40. When the drive circuit 110 is providedin the central portion of the array of the light emitting chips C1-C40,wiring arranged (extracted) from the drive circuit 110 to the lightemitting chips C1-C40 can be distributed equally in the left/rightdirection (the X-direction in FIGS. 3A and 3B). Thus, the width (in theY-direction in FIGS. 3A and 3B) of the mounting board 62 can besuppressed to be small.

Incidentally, the drive circuit 110 may be provided not in the centralportion of the array of the light emitting chips C1-C40 but in one endportion or between the end portion and the central portion.

In addition, the IC chip serving as the drive circuit 110 is connectedto the wiring (lines) in the back surface of the mounting board 62, forexample, by a BGA (Ball Grid Array) or the like.

The thermistors 111 and 112 are NTC (Negative Temperature Coefficient)thermistors, which are elements having negative temperaturecharacteristics in which their resistance values decrease in response toa temperature rise. The temperature detection portions of thethermistors 111 and 112 are fixed in contact with the mounting board 62.Thus, the thermistors 111 and 112 can detect the temperature of themounting board 62.

Since back electrodes 85 of the light emitting chips C are fixed to themounting board 62 as will be described later, the temperature of themounting board 62 is correlated with the temperatures of the lightemitting chips C.

Here, each thermistor 111, 112 is provided just behind the light sourceportion 63 so as to put the mounting board 62 therebetween. “Just behindthe light source portion 63” means that at least a part of thethermistor 111, 112 overlaps with a projected image of the light sourceportion 63 when the light source 63 is projected on the back surface ofthe mounting board 62. This is to detect the temperature of the lightsource portion 63 more accurately through the temperature of themounting board 62.

Incidentally, one or both of the thermistors 111 and 112 may be providedin a position deviated from the position just behind the light sourceportion 63. In addition, one or both of the thermistors 111 and 112 maybe provided in the front surface of the mounting board 62.

FIGS. 4A and 4B are diagrams showing the configuration of each lightemitting chip C and the configuration of the light emitting device 65.FIG. 4A shows the configuration of the light emitting chip C, and FIG.4B shows the configuration of the drive circuit 110 of the lightemitting device 65 and the configuration of wirings (lines) on themounting board 62.

As described previously, the drive circuit 110 is provided on the backsurface of the mounting board 62 and in a central portion of the arrayof the light emitting chips C1-C40. In FIG. 4B, the drive circuit 110 isdepicted on the left side of the mounting board 62 for convenience ofexplanation.

First, the configuration of the light emitting chip C shown in FIG. 4Awill be described.

The light emitting chip C has a light emitting portion 102 constitutedby plural light emitting elements (light emitting thyristors L1, L2, L3,. . . in the exemplary embodiment) on a substrate 80 having arectangular surface shape. The light emitting elements are provided onthe closer side to one long side of the rectangular shape and in a lineextending along the long side (in the x-direction in FIG. 4A). Further,in the opposite end portions in the long side direction, the lightemitting chip C has plural terminals (a φ1 terminal, φ2 terminal, a φIterminal, and a Vga terminal) for importing various drive signals and soon.

Of those terminals, the terminal φ1 and the Vga terminal are provided inorder from one end portion of the substrate 80, and the φI terminal andthe φ2 terminal are provided in order from the other end portion of thesubstrate 80. The light emitting portion 102 is provided between the Vgaterminal and the φ2 terminal. Further, a back electrode 85 serving as aVsub terminal is provided on the back surface of the substrate 80.

The back electrode 85 is fixed to a wiring (line) provided in the frontsurface of the mounting board 62, by silver paste or the like.

The terminals (the φ1 terminal, the φ2 terminal, the φI terminal, andthe Vga terminal) are bonding pads, which are connected to wirings(lines) provided in the front surface of the mounting board 62, throughbonding wires.

Incidentally, the terminals (the φ1 terminal, the φ2 terminal, the φIterminal, and the Vga terminal) may be arrayed in another order than theorder shown in FIG. 4A.

Here, “in a line” does not always mean a case where plural lightemitting elements are disposed on a straight line in the x-direction asshown in FIG. 4A. The light emitting elements may be disposed so thatthey have different displacements from one another in the y-directionperpendicular to the direction of the line. For example, when the lightemitting surfaces of the light emitting elements form pixelsrespectively, each light emitting element may be disposed with adisplacement corresponding to several pixels or several tens of pixelsin the y-direction perpendicular to the x-direction as the direction ofthe line. The light emitting elements may be disposed in a zigzag mannerin which the light emitting elements are displaced alternately betweenadjacent ones or between adjacent sets of plural ones.

Next, the configuration of the drive circuit 110 of the light emittingdevice 65 and the configuration of wirings (lines) on the mounting board62 will be described with reference to FIG. 4B.

As described previously, on the mounting board 62 of the light emittingdevice 65, the drive circuit 110 and the light emitting chips C1-C40 aremounted, and wirings (lines) for connecting the drive circuit 110 withthe light emitting chips C1-C40 are provided.

First, the configuration of the drive circuit 110 will be described.

The drive circuit 110 receives control signals including a clock signal,reference potential, power supply potential, etc. from the image formingcontroller 30 shown in FIG. 1, and image data (video signals) processedby the image processing portion 40. The image data are to be supplied toeach light emitting chip C.

From the control signals and the image data, the drive circuit 110generates signals (a first transfer signal φ1, a second transfer signalφ2, and lighting signals φI1-φI40, which will be described later) fordriving the light emitting chips C.

Incidentally, the drive circuit 110 corrects emission amounts (radiantenergies) and supplies the lighting signals φI1-φI40 (which will bereferred to as light signals φI when they are not distinguishedindividually), as will be described later.

That is, the drive circuit 110 has a transfer signal generating portion120, which generates the first transfer signal φ1 and the secondtransfer signal φ2 and supplies them to the light emitting chips C1-C40.

In addition, the drive circuit 110 has a lighting signal generatingportion 140, which generates the lighting signals φI1-φI40 based onvarious control signals and supplies them to the light emitting chipsC1-C40 respectively.

Further, the drive circuit 110 has a reference potential supply portion160 and a power supply potential supply portion 170. The referencepotential supply portion 160 supplies the reference potential Vsub tothe light emitting chips C1-C40. The reference potential Vsub serves asa reference of potential. The power supply potential supply portion 170supplies the power supply potential Vga for driving the light emittingchips C1-C40.

Next, the arrangement of the light emitting chips C1-C40 will bedescribed.

The odd-numbered light emitting chips C1, C3, C5, . . . are arranged ina line so as to be spaced from one another in a direction along the longsides of the respective substrates 80. The even-numbered light emittingchips C2, C4, C6, . . . are arranged in the same manner. Theodd-numbered light emitting chips C1, C3, C5, . . . and theeven-numbered light emitting chips C2, C4, C6, . . . are arranged in azigzag manner and rotated 180 degrees relatively to each other so thatthe long side on the light emitting portion 102 side of eachodd-numbered light emitting chip C can be opposed to the long side onthe light emitting portion 102 side of each even-numbered light emittingchip C. The light emitting chips C are also positioned so that lightemitting elements adjacent to each other between adjacent ones of thelight emitting chips C can be arranged at the same interval in the mainscanning direction (X-direction) as light emitting elements adjacent toeach other within the same light emitting element.

Incidentally, FIG. 4B shows the light emitting chips C1-C9. The arrowdepicted in each light emitting chip C1-C9 designates the direction inwhich the light emitting elements of the light emitting portion 102shown in FIG. 4A are arranged (the numerical order of the light emittingthyristors L1, L2, L3, . . . in the exemplary embodiment).

The wirings (lines) connecting the drive circuit 110 with the lightemitting chips C1-C40 will be described. Incidentally, the lightemitting chips C1-C40 are provided on the front surface of the mountingboard 62. On the other hand, the drive circuit 110 is provided on theback surface of the mounting board 62. Therefore, the wirings (lines)are provided via the front surface and back surface of the mountingboard 62 and the through-holes provided in the substrate of the mountingboard 62.

A power supply line 200 a for supplying the reference potential Vsub isprovided in the mounting board 62. The power supply line 200 a isconnected to the Vsub terminal provided in the back electrode 85 servingas the Vsub terminal provided in the back surface of each light emittingchip C.

A power supply line 200 b for supplying the power supply potential Vgafor driving each light emitting chip C is provided in the mounting board62. The power supply line 200 b is connected to the Vga terminalprovided in each light emitting chip C.

The mounting board 62 is provided with a first transfer signal line 201and a second transfer signal line 202. The first transfer signal φ1 istransmitted from the transfer signal generating portion 120 of the drivecircuit 110 to each light emitting chip C through the first transfersignal line 201. The second transfer signal φ2 is transmitted from thetransfer signal generating portion 120 to each light emitting chip Cthrough the second transfer signal line 202. The first transfer signalline 201 is connected to the φ1 terminal of each light emitting chip C,and the second transfer signal line 202 is connected to the φ2 terminalof each light emitting chip C. The first transfer signal φ1 and thesecond transfer signal φ2 are transmitted to the light emitting chipsC1-C40 in common (in parallel).

In addition, the mounting board 62 is provided with lighting signallines 204_1-204_40. The lighting signals φI1-φI40 are transmitted fromthe lighting signal generating portion 140 of the drive circuit 110 tothe light emitting chips C1-C40 through the lighting signal lines204_1-204_40 respectively. The lighting signal lines 204_1-204_40 areconnected to the φI terminals of the light emitting chips C1-C40 throughcurrent limiting resistors RI respectively.

As has described above, the reference potential Vsub and the powersupply potential Vga are commonly supplied to the light emitting chipsC1-C40 on the mounting board 62. The first transfer signal φ1 and thesecond transfer signal φ2 are also commonly (in parallel) transmitted tothe light emitting chips C1-C40. On the other hand, the lighting signalsφI1-φI40 are transmitted to the light emitting chips C1-C40 respectivelyand individually.

(Configuration of Light Emitting Chip C)

FIG. 5 is an equivalent circuit diagram for explaining the circuitconfiguration of a light emitting chip C mounted with a self-scanningtype light emitting element array (SLED). Incidentally, the positions ofthe terminals (the φ1 terminal, the φ2 terminal, the Vga terminal andthe φI terminal) are different from those in FIG. 4A. The terminals aredepicted at the left end of FIG. 5 for convenience of explanation. TheVsub terminal provided in the back surface of the substrate 80 isdepicted in a state where it has been extracted to the outside of thesubstrate 80.

Here, the light emitting chip C1 will be described as a representativeof each light emitting chip C in order to explain them includingconnection to the drive circuit 110. In FIG. 5, the light emitting chipC is therefore referred to as light emitting chip C1(C). Theconfigurations of the other light emitting chips C2-C40 are the same asthat of the light emitting chip C1.

The light emitting chip C1(C) has a light emitting portion 102 (see FIG.4A) constituted by light emitting thyristors L1, L2, L3, . . . arrangedin a line on a substrate 80 as described previously.

In addition, the light emitting chip C1(C) has transfer thyristors T1,T2, T3, . . . arranged in a line in the same manner as the lightemitting portion 102.

Incidentally, FIG. 5 shows parts of the light emitting chip C1(C) aroundthe light emitting thyristors L1-L4 and the transfer thyristors T1-T4.

In addition, the light emitting chip C1(C) has coupling diodes Dx1, Dx2,Dx3, . . . . Adjacent two of the transfer thyristors T1, T2, T3, . . .are paired with each other in numerical order, and the coupling diodesDx1, Dx2, Dx3, . . . are provided between the pairs respectively.

Further, the light emitting chip C1(C) has power supply line resistorsRgx1, Rgx2, Rgx3, . . . .

In addition, the light emitting chip C1(C) has a start diode Dx0. Thelight emitting chip C1(C) also has current limiting resistors R1 and R2for preventing an excessive current from flowing into the first transfersignal line 72 through which the first transfer signal φ1 istransmitted, and the second transfer signal line 73 through which thesecond transfer signal φ2 is transmitted, as will be described later.

The light emitting thyristors L1, L2, L3, . . . and the transferthyristors T1, T2, T3, . . . are arranged in numerical order from theleft side in FIG. 5. Further, the coupling diodes Dx1, Dx2, Dx3, . . .and the power supply line resistors Rgx1, Rgx2, Rgx3, . . . are alsoarranged in numerical order from the left side in FIG. 5.

The light emitting thyristors L1, L2, L3, . . . and the transferthyristors T1, T2, T3, . . . are arrayed in order of the transferthyristors T1, T2, T3, . . . and the light emitting thyristors L1, L2,L3, . . . from top to bottom in FIG. 5.

Here, the light emitting thyristors L1, L2, L3, . . . , the transferthyristors T1, T2, T3, . . . , the coupling diodes Dx1, Dx2, Dx3, . . ., and the power supply line resistors Rgx1, Rgx2, Rgx3, . . . will bereferred to as light emitting thyristors L, transfer thyristors T,coupling diodes Dx, and power supply line resistor Rgx respectively whenthey are distinguished individually.

The number of light emitting thyristors L may be set in advance. In theexemplary embodiment, the number of light emitting thyristors L is 128by way of example. On this occasion, the number of transfer thyristors Tis also 128. Likewise, the number of power supply line resistors Rgx isalso 128. However, the number of coupling diodes Dx is 127, which issmaller than the number of transfer thyristors T by one.

Incidentally, the number of transfer thyristors T may be larger than thenumber of light emitting thyristors L.

Each of the aforementioned thyristors (the light emitting thyristors Land the transfer thyristors T) is a semiconductor device having threeterminals, that is, a gate terminal, an anode terminal and a cathodeterminal.

The anode terminals of the transfer thyristors T and the light emittingthyristors L are connected to the substrate 80 of the light emittingchip C1(C) (anode common).

In addition, the anode terminals are connected to the power supply line200 a (see FIG. 4B) through the back electrode 85 serving as the Vsubterminal and provided in the back surface of the substrate 80. Thereference potential Vsub is supplied from the reference potential supplyportion 160 through the power supply line 200 a.

The cathode terminals of the odd-numbered transfer thyristors T1, T3, .. . in the arrangement of the transfer thyristors T are connected to thefirst transfer signal line 72. The first transfer signal line 72 isconnected to the φ1 terminal through the current limiting resistor R1.The first transfer signal φ1 is received from the φ1 terminal.

On the other hand, the cathode terminals of the even-numbered transferthyristors T2, T4, . . . in the arrangement of the transfer thyristors Tare connected to the second transfer signal line 73. The second transfersignal line 73 is connected to the φ2 terminal through the currentlimiting resistor R2. The second transfer signal φ2 is received from theφ2 terminal.

The cathode terminals of the light emitting thyristors L1, L2, L3, . . .are connected to the lighting signal line 75. The lighting signal line75 is connected to the φI terminal. The φI terminal of the lightemitting chip C1 is connected to the lighting signal line 204_1 throughthe current limiting resistor RI so that the lighting signal φI1 can bereceived from the lighting signal generating portion 140. Incidentally,the φI terminals of the other light emitting chips C2-C40 are connectedto the lighting signal lines 204_2-204_40 through the current limitingresistors RI respectively, so that the lighting signals φI2-φI40 can bereceived from the lighting signal generating portion 140.

Gate terminals Gt1, Gt2, Gt3, . . . of the transfer thyristors T1, T2,T3, . . . are connected to gate terminals Gl1, Gl2, Gl3, . . . of thelight emitting thyristors L1, L2, L3, . . . with the same numbersrespectively in one to one correspondence. Therefore, each of the gateterminals Gt1, Gt2, Gt3, . . . has electrically the same potential as acorrespondingly numbered one of the gate terminals Gl1, Gl2, Gl3, . . .. Therefore, for example, the gate terminal Gt1 may be referred to asgate terminal Gt1(Gl1).

Also here, the gate terminals Gt1, Gt2, Gt3, . . . , and the gateterminals Gl1, Gl2, Gl3, . . . will be referred to as gate terminals Gtand gate terminals Gl when they are not distinguished individually. Inaddition, they may be referred to as gate terminals Gt(Gl).

Adjacent two of the gate terminals Gt1, Gt2, Gt3, . . . of the transferthyristors T1, T2, T3, . . . are paired with each other in numericalorder, and the coupling diodes Dx1, Dx2, Dx3, . . . are connectedbetween the paired gate terminals Gt respectively. That is, the couplingdiodes Dx1, Dx2, Dx3, . . . are connected in series so as to be putamong the gate terminals Gt1, Gt2, Gt3, . . . in order. The couplingdiode Dx1 is connected so that the direction of the coupling diode Dx1can follow the direction of an current flowing from the gate terminalGt1 toward the gate terminal Gt2. The same thing can be applied to theother coupling diodes Dx2, Dx3, Dx4, . . . .

The gate terminals Gt(Gl) of the transfer thyristors T are connected tothe power supply line 71 through the power supply line resistors Rgxprovided in accordance with the transfer thyristors T respectively. Thepower supply line 71 is connected to the Vga terminal.

The gate terminal Gt1 of the transfer thyristor T1 on one end side ofthe transfer thyristor array is connected to the cathode terminal of thestart diode Dx0. On the other hand, the anode terminal of the startdiode Dx0 is connected to the second transfer signal line 73.

In FIG. 5, of the light emitting chip C1(C), the part provided with thetransfer thyristors T, the coupling diodes Dx, the power supplyresistors Rgx, the start diode Dx0 and the current limiting resistors R1and R2 is referenced as a transfer portion 101. As described previously,the part provided with the light emitting thyristors L corresponds tothe light emitting portion 102.

Each light emitting chip C is, for example, constituted by a group III-Vcompound semiconductor such as GaAs or GaAlAs. That is, the lightemitting chip C has a pnpn structure in which a first semiconductorlayer having p-type conductivity, a second semiconductor layer havingn-type conductively, a third semiconductor layer having p-typeconductivity, and a fourth semiconductor layer having n-typeconductivity have been laminated sequentially on a substrate havingp-type conductivity. The light emitting chip C is constituted by pluralislands in which plural semiconductor layers have been separated fromone another by separation grooves.

(Operation of Light Emitting Device 65)

Next, the operation of the light emitting device 65 will be described.

As described previously, the light emitting device 65 are provided withthe light emitting chips C1-C40 (see FIGS. 3A-3B and 4A-4B).

As shown in FIG. 4B, the reference potential Vsub and the power supplypotential Vga are supplied in common to all the light emitting chipsC1-C40 on the mounting board 62. In the same manner, the first transfersignal φ1 and the second transfer signal φ2 are transmitted to the lightemitting chips C1-C40 in common (in parallel).

On the other hand, the lighting signals φI1-φI40 are transmitted to thelight emitting chips C1-C40 respectively and individually. The lightingsignals φI1-φI40 are signals for setting the light emitting thyristors Lof the light emitting chips C1-C40 in a lighting state or a non-lightingstate in accordance with the image data respectively. Therefore, thelighting signals φI1-φI40 have different waveforms from one anotherdepending on the image data. However, the lighting signals φI1-φI40 aretransmitted in parallel.

Since the light emitting chips C1-C40 are driven in parallel, it issufficient that the operation of the light emitting chip C1 will bedescribed.

<Thyristors>

The fundamental operation of the thyristors (the transfer thyristors Tand the light emitting thyristors L) will be described beforedescription of the operation of the light emitting chip C1. Eachthyristor is a semiconductor device having three terminals, that is, ananode terminal, a cathode terminal and a gate terminal as describedpreviously.

The following description will be made on the assumption that thereference potential Vsb to be supplied to the back electrode 85 servingas the Vsub terminal is high-level potential (hereinafter referred to as“H”) which is 0 V, and the power supply potential Vga to be supplied tothe Vga terminal is low-level potential (hereinafter referred to as “L”)which is −3 V.

In the exemplary embodiment, the light emitting device 65 is driven bynegative potential.

The anode terminal of each thyristor is in the reference potential Vsub(“H” (0 V)) supplied to the back electrode 85.

The thyristor has a pnpn structure constituted by four semiconductorlayers, that is, a p-type first semiconductor layer, an n-type secondsemiconductor layer, a p-type third semiconductor layer and an n-typefourth semiconductor layer laminated on a p-type substrate. Thefollowing description will be made on the assumption that forwarddirection potential (diffusion potential) Vd of a pn junctionconstituted by a p-type semiconductor layer and an n-type semiconductorlayer of a group III-V compound semiconductor such as GaAs or GaAlAs is1.5 V by way of example.

When lower potential (negative potential with a large absolute value)than a threshold voltage is applied to the cathode terminal of thethyristor in an OFF state where a current is small (not to flow) betweenthe anode terminal and the cathode terminal, the thyristor moves to anON state (turns ON). Here, the threshold voltage of the thyristor is avalue obtained by subtracting the forward direction potential Vd (1.5 V)of the pn junction from the potential of the gate terminal. Therefore,when the potential of the gate terminal is 0 V, the threshold voltage ofthe thyristor is −1.5 V. That is, when lower potential than −1.5 V isapplied to the cathode terminal, the thyristor turns ON. When thethyristor turns ON, the thyristor is brought into a state (ON state)where a current has flowed between the anode terminal and the cathodeterminal.

The potential of the gate terminal of the thyristor in the ON statereaches potential close to the potential of the anode terminal. Here,assume that the potential of the gate terminal is 0 V (“H”) because theanode terminal has been set at the reference potential Vsub (0 V (“H”)).On the other hand, the cathode terminal of the thyristor in the ON statehas potential close to potential obtained by subtracting the forwarddirection potential Vd (1.5 V) of the pn junction from the potential ofthe anode terminal. Here, the potential of the cathode terminal of thethyristor in the ON state has potential (negative potential with anabsolute value larger than 1.5 V) close to −1.5 V because the anodeterminal is set at the reference potential Vsub (0 V (“H”)).Incidentally, the potential of the cathode terminal is set depending onthe relation to a power supply which supplies a current to the thyristorin the ON state.

When higher potential (negative potential with a small absolute value,0V, or positive potential) than potential (the aforementioned potentialclose to −1.5 V) required for keeping the ON state is applied to thecathode terminal of the thyristor which has once turned ON, thethyristor moves to the OFF state (turns OFF). For example, when thecathode terminal reaches “H” (0 V), the potential of the cathodeterminal is higher than the potential required for keeping the ON state,and the potential of the cathode terminal is as high as the potential ofthe anode terminal. Thus, the thyristor turns OFF.

On the contrary, when lower potential (negative potential with a largeabsolute value) than the potential required for keeping the ON state iscontinuously applied to the cathode terminal of the thyristor which isin the ON state, the thyristor keeps the ON state.

When the light emitting thyristor L turns ON, the light emittingthyristor L is lit (emits light). When the light emitting thyristor Lturns OFF, the light emitting thyristor is put out (not lit). Theemission amount of the light emitting thyristor L in the ON statedepends on an area of the light emitting surface from which light isemitted, and a current flowing between the cathode terminal and theanode terminal.

<Timing Chart>

FIG. 6 is a timing chart for explaining the operation of the lightemitting device 65 and the light emitting chip C.

FIG. 6 shows a timing chart of a part making control (referred to aslighting control) to tarn on/off five light emitting thyristors L, thatis, the light emitting thyristors L1-L5 of the light emitting chip C1.As described previously, since the other light emitting chips C2-C40operate in parallel with the light emitting chip C1, it is sufficientthat the operation of the light emitting chip C1 will be described.

Incidentally, in FIG. 6, the light emitting thyristors L1, L2, L3 and L5of the light emitting chip C1 are lit, while the light emittingthyristor L4 is put out (not lit).

In FIG. 6, assume that time goes in alphabetical order from time a totime k. Control of lighting or non-lighting (lighting control) isperformed on the light emitting thyristor L1 in a period T(1) from timeb to time e, on the light emitting thyristor L2 in a period T(2) fromthe time e to time i, on the light emitting thyristor L3 in a periodT(3) from the time i to time j, and on the light emitting thyristor L4in a period T(4) from the time j to the time k. In the same manner,lighting control is also performed on the other light emittingthyristors assigned with numbers not lower than 5.

Description will be made about the waveforms of the first transfersignal φ1, the second transfer signal φ2, and the lighting signal φI1.Incidentally, the period from the time a to the time b is a period whenthe light emitting chip C1 (the same thing can be applied to the lightemitting chips C2-C40) begins to operate. Signals in this period will beexplained when the operation is described.

The first transfer signal φ1 transmitted to the φ1 terminal (see FIG. 5and FIG. 6) and the second transfer signal φ2 transmitted to the φ2terminal (see FIG. 5 and FIG. 6) are signals which can have twopotentials “H” and “L”. The first transfer signal φ1 and the secondtransfer signal φ2 repeat waveforms in units of two consecutive periodsT (for example, the period T(1) and the period T(2)).

The first transfer signal φ1 moves from “H” to “L” at the start time bof the period T(1), and moves from “L” to “H” at the time f. Then, thefirst transfer signal φ1 moves from “H” to “L” at the end time i of theperiod T(2).

The second transfer signal φ2 is “H” at the start time b of the periodT(1), and moves from “H” to “L” at the time e. Then, the second transfersignal φ2 keeps “L” at the end time i of the period T(2).

When the first transfer signal φ1 and the second transfer signal φ2 arecompared with each other, the second transfer signal φ2 corresponds to asignal in which the first transfer signal φ1 has been shifted later bythe period T on the time axis. In the first transfer signal φ1, thewaveform in the period T(1) and the waveform in the period T(2) arerepeated in and after the period T(3). On the other hand, in the secondtransfer signal φ2, the waveform shown by the broken line in the period(1) and the waveform in the period T(2) are repeated in and after theperiod T(3). The waveform of the second transfer signal φ2 in the periodT(1) differs from that in and after the period T(3) because the periodT(1) is a period when the light emitting device 65 begins to operate.

The paired transfer signals, that is, the first transfer signal φ1 andthe second transfer signal φ2 propagate the ON state to the transferthyristors T shown in FIG. 5 in numerical order. Thus, the lightemitting thyristors L whose numbers correspond to the numbers of thetransfer thyristors T in the ON state are designated as targets to becontrolled to be lit or not lit (lighting control)

Next, the lighting signal φI1 transmitted to the φI terminal of thelight emitting chip C1 will be described. Incidentally, the lightingsignals φI2-φI40 are transmitted to the light emitting chip C2-C40respectively. The lighting signal φI1 is a signal which can have twopotentials “H” and “L”.

Here, the lighting signal φI1 will be described in the period T(1) oflighting control on the light emitting thyristor L1 of the lightemitting chip C1. Incidentally, assume that the light emitting thyristorL1 is lit.

The lighting signal φI1 is “H” at the start time b of the period T(1),and moves from “H” to “L” at the time c. Then, the lighting signal φI1moves from “L” to “H” at the time d, and keeps “H” at the end time e ofthe period T(1).

With reference to FIGS. 4A-4B and FIG. 5, the operation of the lightemitting device 65 and the light emitting chip C1 will be describedalong the timing chart shown in FIG. 6. Incidentally, the followingdescription will be made about the periods T(1) and T(2) when lightingcontrol is performed on the light emitting thyristors L1 and L2.

(1) Time a

<Light Emitting Device 65>

At the time a, the reference potential supply portion 160 of the drivecircuit 110 of the light emitting device 65 sets the reference potentialVsub as “H” (0 V). The power supply potential supply portion 170 setsthe power supply potential Vga as “L” (−3.3 V). As a result, the powersupply line 200 a on the mounting board 62 of the light emitting device65 reaches “H” (0 V) set in the reference potential Vsub, and the Vsubterminal of each light emitting chip C1-C40 reaches “H”. In the samemanner, the power supply line 200 b reaches “L” (−3.3 V) of the powersupply potential Vga, and the Vga terminal of each light emitting chipC1-C40 reaches “L” (see FIG. 4B). As a result, the power supply line 71of each light emitting chip C1-C40 reaches “L” (see FIG. 5).

Then the transfer signal generating portion 120 of the drive circuit 110sets the first transfer signal φ1 and the second transfer signal φ2 as“H”. Thus, the first transfer signal line 201 and the second transfersignal line 202 reach “H” (see FIG. 4B). As a result, the φ1 terminaland φ2 terminal of each light emitting chip C1-C40 reach “H”. Thepotential of the first transfer signal line 72 connected to the φ1terminal through the current limiting resistor R1 also reaches “H”, andthe potential of the second transfer signal line 73 connected to the φ1terminal through the current limiting resistor R2 also reaches “H” (seeFIG. 5).

Further, the lighting signal generating portion 140 of the drive circuit110 sets the lighting signals φI1-φI40 as “H”. As a result, the lightingsignal lines 204_1-204_40 reach “H” (see FIG. 4B). Thus, the φI terminalof each light emitting chip C1-C40 reaches “H” through the currentlimiting resistor RI, and the lighting signal line 75 connected to theφI terminal also reaches “H” (see FIG. 5).

<Light Emitting Chip C1>

The anode terminals of the transfer thyristors T and the light emittingthyristors L are connected to the Vsub terminal. Therefore, the anodeterminals are set as “H” (0V).

The cathode terminals of the odd-numbered transfer thyristors T1, T3,T5, . . . are connected to the first transfer signal line 72, and set as“H”. The cathode terminals of the even-numbered transfer thyristors T2,T4, T6, . . . are connected to the second transfer signal line 73, andset as “H”. Accordingly, each transfer thyristor T is in the OFF statebecause both the anode terminal and the cathode terminal thereof are“H”.

The cathode terminal of each light emitting thyristor L is connected tothe lighting signal line 75 which is “H”. Accordingly, the lightemitting thyristor L is also in the OFF state because both the anodeterminal and the cathode terminal thereof are “H”.

The gate terminal Gt1 at one end of the transfer thyristor array in FIG.5 is connected to the cathode terminal of the start diode Dx0 asdescribed previously. The gate terminal Gt1 is connected to the powersupply line 71 of the power supply potential Vga (“L” (−3.3 V)) throughthe power supply line resistor Rgx1. The anode terminal of the startdiode Dx0 is connected to the second transfer signal line 73, andconnected to the φ2 terminal of “H” (0 V) through the current limitingresistor R2. Accordingly, the start diode Dx0 is forward biased. Thecathode terminal (gate terminal Gt1 (Gl1)) of the start diode Dx0 has apotential value (−1.5 V) obtained by subtracting the forward directionpotential Vd (1.5 V) of the pn junction from the potential (“H” (0V)) ofthe anode terminal of the start diode Dx0. In addition, when the gateterminal Gt1 reaches −1.5 V, the coupling diode Dx1 whose anode terminal(gate terminal Gt1) is −1.5 V and whose cathode terminal is connected tothe power supply line 71 (“L” (−3.3 V)) through the power supply lineresistor Rgx2 is forward biased. Accordingly, the potential of the gateterminal Gt2 reaches −3 V obtained by subtracting the forward directionpotential Vd (1.5 V) of the pn junction from the potential (−1.5 V) ofthe gate terminal Gt1. However, each gate terminal Gt whose number isnot lower than 3 is not influenced by the fact that the anode terminalof the start diode Dx0 is “H” (0 V). The potential of the gate terminalGt is “L” (−3.3 V) as low as the potential of the power supply line 71.

Incidentally, as described previously, the gate terminal Gt is connectedto the gate terminal Gl. Accordingly, the potential of the gate terminalGl is equal to the potential of the gate terminal Gt. Therefore, thethreshold voltage of each transfer thyristor T and each light emittingthyristor L is a value obtained by subtracting the forward directionpotential Vd (1.5 V) of the pn junction from the potential of the gateterminal Gt (Gl). That is, the threshold voltage of the transferthyristor T1 and the light emitting thyristor L1 is −3 V, the thresholdvoltage of the transfer thyristor T2 and the light emitting thyristor L2is −4.5 V, and the threshold voltage of the transfer thyristors T andthe light emitting thyristors L whose numbers are not lower than 3 is−4.8 V.

(2) Time b

At the time b shown in FIG. 6, the first, transfer signal φ1 moves from“H” (0 V) to “L” (−3.3 V). As a result, the light emitting device 65 andthe light emitting chip C1 begin to operate. The operation of the lightemitting chip C1 will be described below.

When the first transfer signal φ1 moves from “H” to “L”, the potentialof the first transfer signal line 72 moves from “H” to “L” through theφ1 terminal and the current limiting resistor R1. Thus, the transferthyristor T1 whose threshold voltage is −3 V turns ON.

When the transfer thyristor T1 turns CM, the potential of the firsttransfer signal line 72 reaches −1.5 V obtained by subtracting theforward direction potential Vd (1.5 V) of the pn junction from thepotential (“H” (0 V)) of the anode terminal.

When the transfer thyristor T1 turns on, the potential of the gateterminal Gt1 (Gl1) reaches “H” (0 V) as high as the potential of theanode terminal of the transfer thyristor T1. Thus, the potential of thegate terminal Gt2 (Gl2) reaches −1.5 V, the potential of the gateterminal Gt3 (Gl3) reaches −3 V, and the potential of each gate terminalGt (Gl) whose number is not lower than 4 reaches “L” (−3.3 V).

As a result, the threshold voltage of the light emitting thyristor L1 is−1.5 V, the threshold voltage of the transfer thyristor T2 and the lightemitting thyristor L2 is −3 V, and the threshold voltage of the transferthyristors T and the light emitting thyristors L whose numbers are notlower than 4 is −4.8 V.

(3) Time c

At the time c, the lighting signal φI1 moves from “H” to “L”.

Accordingly, the lighting signal line 75 moves from “H” to “L” throughthe current limiting resistor RI and the φ1 terminal. Thus, thepotential of the light emitting thyristor L1 whose threshold voltage is−1.5 V turns ON to be lit (emit light). As a result, the potential ofthe lighting signal line 75 reaches potential (negative potential whoseabsolute value is larger than 1.5 V) close to −1.5 V.

(4) Time d

At the time d, the lighting signal φI1 moves from “L” to “H”.

Accordingly, the potential of the lighting signal line 75 moves from “L”to “H” through the current limiting resistor RI and the φ1 terminal.Thus, the light emitting thyristor L1 turns OFF to be put out (not lit)because both the anode terminal and the cathode terminal reach “H”. Thelighting period of the light emitting thyristor L1 is a period when thelighting signal φI1 is “L” between the time c when the lighting signalφI1 moves from “H” to “L” and the time d when the lighting signal φI1moves from “L” to “H”.

(5) Time e

At the time e, the second transfer signal φ2 moves from “H” to “L”.Here, the period T(1) in which lighting control is performed on thelight emitting thyristor L1 is terminated, and the period T(2) in whichlighting control is performed on the light emitting thyristor L2 isstarted.

When the second transfer signal φ2 moves from “H” to “L”, the potentialof the second transfer signal line 73 moves from “H” to “L” through theφ2 terminal. As described previously, the threshold voltage of thetransfer thyristor T2 is −3 V. Therefore, the transfer thyristor T2turns ON. As a result, the potential of the gate terminal Gt2 (Gl2)reaches “H” (0 V), the potential of the gate terminal Gt3 (Gl3) reaches−1.5 V, and the potential of the gate terminal Gt4 (Gl4) reaches −3 V.The potential of each gate terminal Gt (Gl) whose number is not lowerthan 5 reaches −3.3 V.

(6) Time f

At the time f, the first transfer signal φ1 moves from “L” to “H”.

Accordingly, the potential of the first transfer signal line 72 movesfrom “L” to “H” through the φ1 terminal. Thus, the transfer thyristor T1in the OK state turns OFF because both the anode terminal and thecathode terminal reach “H”. In response thereto, the potential of thegate terminal Gt1 (Gl1) changes toward the power supply potential Vga(“L” (−3.3 V)) of the power supply line 71 through the power supply lineresistor Rgx1. As a result, the coupling diode Dx1 is brought into astate where potential has been applied in a direction to prevent acurrent from flowing therein (reverse biased). Therefore, the gateterminal Gt1 (Gl1) is not influenced by the fact that the gate terminalGt2 (Gl2) is “H” (0 V). That is, the threshold voltage of the transferthyristor T including the gate terminal Gt to which the reverse biasedcoupling diode Dx is connected reaches −4.8 V, so that the transferthyristor T cannot, turn off in response to the first transfer signal φ1or the second transfer signal φ2 which is “L” (−3.3 V).

(7) Etcetera

When the lighting signal φI1 moves from “H” to “L” at the time g, thelight emitting thyristor L2 turns OH to be lit in the same manner as thelight emitting thyristor L1 at the time c.

When the lighting signal φI1 moves from “L” to “H” at the time h, thelight emitting thyristor L2 turns OFF to be put out in the same manneras the light emitting thyristor L1 at the time d.

Further, when the lighting signal φI1 moves from “H” to “L” at the timei, the transfer thyristor T3 whose threshold voltage is −3 V turns ON inthe same manner as the transfer thyristor T1 at the time b or thetransfer thyristor T2 at the time e. At the time i, the period T(2) inwhich lighting control is performed on the light emitting thyristor L2is terminated, and the period T(3) in which lighting control isperformed on the light emitting thyristor L3 is started.

After that, the operation which has been described is repeated.

Incidentally, in order to make a light emitting thyristor L not lit (notemit light) but keep it put out (not lit), it will go well if thelighting signal φI is kept in “H” (0 V) as in the lighting signal φI1shown from the time to the time k in the period T(4) in which lightingcontrol is performed on the light emitting thyristor L4 in FIG. 6. Inthis manner, the light emitting thyristor L4 can be kept being put out(not lit) even if the threshold voltage of the light emitting thyristorL4 is −1.5 V.

As has been described above, the gate terminals Gt of the transferthyristors T are connected to each other by the coupling diodes Dx.Accordingly, when the potential of one gate terminal Gt has changed,there appears a change in the potential of another gate terminal Gtconnected through a forward-biased coupling diode Dx to the gateterminal Gt whose potential has changed. Thus, there appears a change inthe threshold voltage of the transfer thyristor T including the gateterminal whose potential has changed. When the threshold voltage of thetransfer thyristor T is higher than “L” (−3.3 V) (negative potentialwhose absolute value is small), the transfer thyristor T turns ON at thetiming when the first transfer signal φ1 or the second transfer signalφ2 moves from “H” (0 V) to “L” (−3.3 V).

The threshold voltage of the light emitting thyristor L whose gateterminal Gl is connected to the gate terminal Gt of the transferthyristor T in the ON state is −1.5 V. Therefore, the light emittingthyristor L turns ON to be lit (emit light) when the lighting signal φImoves from “H” to “L”.

That is, the transfer thyristor T enters the ON state to therebydesignate the light emitting thyristor L as a target of lightingcontrol. The lighting signal φI sets the light emitting thyristor L as atarget of lighting control to be lit or not lit.

In this manner, the waveform of each lighting signal φI is set inaccordance with image data so as to control each light emittingthyristor L to be lit or not lit.

The light emitting device 65 has a variation in light emission amount(emission amount) among the light emitting thyristors L due to adifference in characteristics among the light emitting thyristors L atthe time of manufacturing, or a difference in temperature among thelight emitting thyristors L.

Incidentally, the emission amounts of the light emitting thyristors Lfluctuate due to a temperature change of the light emitting device 65 asa whole. In this case, the emission amounts of the light emittingthyristors L fluctuate concurrently.

That is, in each light emitting thyristor L constituted by a group III-Vcompound semiconductor such as GaAs or GaAlAs, the emission amountdecreases with increase in temperature.

Therefore, in the exemplary embodiment, the emission amounts of thelight emitting thyristors L are corrected (emission amount correction)to suppress a variation (fluctuation) in emission amount among the lightemitting thyristors L.

The emission amount correction here is attained by adjustment of alighting period in which each light emitting thyristor L is lit(emitting light). For example, in the light emitting thyristor L1, thelighting period from the time c to the time d in FIG. 6 is adjusted.That is, a lighting period for a light emitting thyristor L small inemission amount is made longer than a predetermined lighting period,while a lighting period for a light emitting thyristor L large inemission amount is set to be shorter than a predetermined lightingperiod.

(Emission Amount Correction)

Correction of emission amounts (emission amount correction) will bedescribed below.

First, description will be made about fluctuation in emission amountcaused by a temperature difference among the light emitting thyristors Lof the light source portion 63 in the print head 14.

FIG. 7 is a graph showing an example of fluctuation in emission amount(reduction in emission amount) caused by a temperature difference amongthe light emitting thyristors L in the print head 14. The abscissadesignates a position within the light source portion 63. Here, thelight source portion 63 is 326 mm long. The ordinate designates thereduction ratio of an emission amount (reduction in emission amount)expressed by percentages.

As shown in FIGS. 3A and 3B, assume that the drive circuit 110 isdisposed in a central portion of the mounting board 62. As for thedifference in emission amount among the light emitting thyristors L atthe time of manufacturing, the lighting period of each light emittingthyristor L is set to suppress a variation in emission amount based onthe measured characteristics of the light emitting thyristor L at thetime of manufacturing of the light emitting device 65.

In FIG. 7, “initial” means time just after the operation of the lightemitting device 65 is started. At the initial time, a temperature riseof the drive circuit 110 is small. Therefore, reduction in emissionamount cannot be seen in the light source portion 63.

“Lapse 1” means time after some time has passed since the operationstart of the light emitting device 65. At Lapse 1, the temperature ofthe drive circuit 110 has increased. However, the temperature rise isnot saturated but on the way. Reduction in emission amount is larger inthe central portion of the light source portion 63 than in either endportion. Incidentally, the reduction in emission amount in the centralportion is 5% to 6%. This is because the drive circuit 110 is providedin the central portion of the mounting board 62, causing a temperaturerise in the central portion of the mounting board 62 as compared withthe temperature in the opposite end portions. As a result, the emissionamounts of the light emitting thyristors L decrease.

Further, “Lapse 2” means time after long time has passed since theoperation start of the light emitting device 65. At this time, thetemperature of the drive circuit 110 is saturated. Even at Lapse 2,reduction in emission amount is larger in the central portion of thelight source portion 63 than in either end portion. Incidentally, thereduction in emission amount in the central portion is 7% to 8%.

Reduction in emission amount not lower than 0.5% can be visuallyrecognized as fluctuation in density in a toner image fixed to therecording paper 25. That is, it is preferable that the reduction inemission amount caused by a difference in temperature among the lightemitting thyristors L is suppressed to be lower than 0.5%.

FIG. 8 is a diagram for explaining the configuration of the lightingsignal generating portion 140 in the drive circuit 110.

The lighting signal generating portion 140 in the drive circuit 110 isconnected to the image forming controller 30, the image processingportion 40, and the light emitting chips C. Here, assume that thelighting signal generating portion 140 is connected to the lightemitting chip C1 (see FIG. 4B). Accordingly, a lighting signal outputportion 147 of the lighting signal generating portion 140, which will bedescribed later, outputs a lighting signal φI1. Incidentally, in theconfiguration of the light emitting device 65 shown in FIG. 4B, at leastthe lighting signal output portions 147 are provided in parallel for thelight emitting chips C respectively.

A serial communication portion 141, a correction value A memory 142, acorrection value B memory 143, a correction value computing portion 144,a temperature measuring portion 145, a lighting period calculatingportion 146, and the lighting signal output portions 147 are provided.

Here, though not shown in FIGS. 3A and 3B, a nonvolatile memory 148connected to the drive circuit 110 is provided on the mounting board 62.

The serial communication portion 141 is connected to the image formingcontroller 30, the correction value A memory 142, the correction value Bmemory 143, and the nonvolatile memory 148 so as to make communicationof serial data therebetween. In addition, the serial communicationportion 141 is connected to the lighting period calculating portion 146so as to transmit a reference pulse from the image forming controller 30to the lighting period calculating portion 146. The reference pulseserves for setting a lighting period.

The correction value A memory 142 stores a correction value A forcorrecting the emission amount of each light emitting thyristor L of thelight source portion 63 on the assumption that the light source portion63 is in an environment of reference temperature (for example, 25° C.).

The correction value B memory 143 stores a correction value B for achange in temperature. Here, assume that the correction value A memory142 and the correction value B memory 143 are memories built in thedrive circuit 110, and the memories are volatile memories for storingthe correction values A and B when power is supplied.

The nonvolatile memory 148 stores the correction values A and B to bestored in the correction value A memory 142 and the correction value Bmemory 143. The nonvolatile memory 148 is, for example, an EEPROM(Electrically Erasable Programmable Read-Only Memory) or a flash memory.

Incidentally, the correction value A is an example of a first correctionvalue, and the correction value B is an example of a second correctionvalue. The nonvolatile memory 148 is an example of a nonvolatile memory.

Accordingly, for example, when main power is applied to the imageforming apparatus 1, the image forming controller 30 gives aninstruction to the serial communication portion 141 to transfer (write)the correction value A from the nonvolatile memory 148 to the correctionvalue A memory 142 and the correction value B from the nonvolatilememory 148 to the correction value B memory 143.

Incidentally, the correction value A memory 142 and the correction valueB memory 143 may be nonvolatile memories. In this case, the nonvolatilememory 148 does not have to be used.

Incidentally, the correction value A in the environment of referencetemperature (for example, 25° C.) to be stored in the correction value Amemory 142 can be obtained from the emission amount of the light sourceportion 63 measured when the print head 14 was shipped from a factory.Here, the correction value A is set for each light emitting thyristor Lor for each set of consecutive plural light emitting thyristors L. Forexample, the correction value A is set for each set of two or four lightemitting thyristors L. This is because there is a small difference inemission amount between light emitting thyristors L adjacent to eachother. When the correction value is set for each set of plural lightemitting thyristors L, the data quantity of correction values can bereduced, and the calculation time of a lighting period in the lightingperiod calculating portion 146 can be shortened.

At the time of shipment of the print head 14 from a factory, correctionvalues A obtained thus is stored into the nonvolatile memory 148 throughthe serial communication portion 141 from a measuring apparatusmeasuring the emission amount of the light source portion 63. That is,the correction values A are set for each print head 14.

The correction value B depends on the configuration of the lightemitting device 65 in the print head 14, for example, the material andshape of the mounting board 62, the position where the drive circuit 110is mounted, etc. Therefore, when the configuration of the light emittingdevice 65 is determined, the correction value B is set uniquely. Here,the correction value B is a correction value in the case of a maximumtemperature difference (for example, 30° C.) from the referencetemperature.

The correction value B is also stored into the nonvolatile memory 148from a measuring apparatus through the serial communication portion 141at the time of shipment of the light emitting device 65 from a factory.

The temperature measuring portion 145 is connected to the thermistors111 and 112 and also connected to the correction value computing portion144. The temperature measuring portion 145 measures the temperature ofthe mounting board 62 using the thermistors 111 and 112.

Incidentally, each thermistor 111, 112 is provided just behind the lightsource portion 63 in the mounting board 62. Accordingly, the temperatureof the mounting board 62 measured by the thermistor 111, 112 iscorrelated with the temperatures of the light emitting thyristors L ofthe light source portion 63. Therefore, it can be considered that thetemperature measuring portion 145 measures the temperature of the lightemitting thyristor L disposed just behind the thermistor 111, 112.

The correction value computing portion 144 is connected to thecorrection value A memory 142, the correction value B memory 143 and thetemperature measuring portion 145. The correction value computingportion 144 receives the temperatures measured by the thermistors 111and 112 respectively, and calculates the temperatures of the lightemitting thyristors L in the light source portion 63. Incidentally, thecorrection value computing portion 144 calculates the temperature ofeach light emitting thyristor L when the correction value A is set foreach light emitting thyristor L as described previously. On the otherhand, the correction value computing portion 144 calculates thetemperature of each set of plural light emitting thyristors L when thecorrection value A is set for each set of plural light emittingthyristors L.

Correction values to be applied are computed based on the calculatedtemperatures of the light emitting thyristors L. The computing of thecorrection values will be described later.

The lighting period calculating portion 146 is connected to the imageprocessing portion 40, the serial communication portion 141, thecorrection value computing portion 144, and the lighting signal outputportion 147.

The lighting period calculating portion 146 calculates each lightingperiod based on the reference pulse transmitted from the image formingcontroller 30 through the serial communication portion 141, thecorrection values computed by the correction value computing portion144, and image data received from the image processing portion 40.Incidentally, the reference pulse may be set as a lighting periodwithout correction, or may be a clock.

The lighting signal output portion 147 outputs each lighting signal φI(the lighting signal φI1 in FIG. 8) including a lighting periodcalculated thus. When the reference pulse is a lighting period withoutcorrection, the lighting signal output portion 147 corrects the width ofthe reference pulse in accordance with the lighting period, and outputsthe lighting signal φI (the lighting signal φI1 in FIG. 8).

On the other hand, when the reference pulse is a clock CLK, the lightingsignal output portion 147 outputs the lighting signal φI (the lightingsignal φI1 in FIG. 8) based on the number of clocks CLK corresponding tothe lighting period.

FIG. 9 is a graph for explaining the relationship between the resistancevalue of each thermistor 111, 112 and the temperature. In FIG. 9, theordinate designates the resistance value (kΩ), and the abscissadesignates the temperature (° C.).

The resistance value of each thermistor 111, 112 which is an NTCthermistor changes logarithmically with increase in temperature.Therefore, in the exemplary embodiment, a resistance value ratio isobtained from the thermistor 111, 112 and a resistor serving as areference so that the change with respect to the temperature can bemoderated to improve accuracy in temperature detection.

FIGS. 10A and 10B are graphs showing an example of the relationshipbetween the ratio (resistance value ratio) between the resistance valueof the reference resistor and the resistance value of the thermistor111, 112, and the temperature. FIG. 10A shows the relationship betweenthe resistance value ratio and the temperature, and FIG. 10B shows alook-up table (LUT) stored as correction values B in the correctionvalue B memory 143.

As shown in FIG. 10A, the resistance value ratio has a gentle changewith respect to the temperature.

The resistance value ratios stored in the LUT shown in FIG. 10B arevalues designated by the marks “⋅” in FIG. 10A. The resistance valueratios are stored in areas designated toy addresses in the correctionvalue B memory 143. Incidentally, when a resistance value ratio is notshown in the LUT, a temperature can be obtained by linear interpolationfrom the values shown in the LUT.

The correction value computing portion 144 computes a correction valueto be applied (an actual correction value) based on Expression (1):actual correction value=(correction value B−correction valueA)×(measured temperature difference)/(maximum temperaturedifference)+correction value A

Here, the measured temperature difference is a difference between thereference temperature and the temperature computed by the correctionvalue computed portion 144.

Incidentally, the maximum temperature difference is a temperaturedifference with respect to the correction value B as describedpreviously.

FIG. 11 is a graph showing the relationship among the correction valueA, the correction value B, and the actual correction value. Here, assumethat the drive circuit 110 is disposed in the central portion of thearray of the light emitting chips C in the mounting board 62 as shown inFIGS. 3A and 3B.

The actual correction value is set between the correction value A andthe correction value B as shown by Expression (1). The actual correctionvalue has a maximum in the central portion of the mounting board 62.

Therefore, when such an actual correction value is applied, thefluctuation in emission amount shown in FIG. 7 can be suppressed.

In the exemplary embodiment, the temperature is always measured by thetemperature measuring portion 145 so that the emission amount can becorrected for each image data. As a result, the difference in emissionamount can be kept lower than 0.5%. Thus, fluctuation in density cannotbe visually recognized easily in an image formed on the recording paper25.

Incidentally, in the exemplary embodiment, the two thermistors 111 and112 are mounted on the mounting board 62. One thermistor 111 is disposednear the drive circuit 110, and the other thermistor 112 is disposed ata distant place from the drive circuit 110. That is, the thermistor 112(second temperature detector) is provided in a farther position from thedrive circuit 110 than the thermistor 111 (first temperature detector).

When the two thermistors 111 and 112 are used thus, it is preferablethat one is disposed in a part where the temperature is highest, and theother is disposed in a part where the temperature is lowest. That is,the accuracy in calculating the temperature of each light emittingthyristor L in the light source portion 63 can be improved as thetemperature is larger.

In addition, three or more thermistors (temperature detectors) may bemounted for measuring temperatures on the mounting board 62. Also inthis case, if is preferable that the thermistors are disposed to securelarger temperature differences among the thermistors. In this manner,the temperature distribution in the mounting board 62 (light sourceportion 63) can be computed more accurately. For example, when pluraldrive circuits 110 are provided on the mounting board 62, heat isgenerated in plural parts corresponding to the plural drive circuits110. It is therefore preferable that plural thermistors (temperaturedetectors) are provided correspondingly to the drive circuits 110respectively so that the temperature distribution in the mounting board62 (light emitting elements) can be computed accurately.

Incidentally, the light emitting device 65 can be arranged not to mountany drive circuit 110 on the mounting board 62 mounted with the lightsource portion 63. However, when the drive circuit 110 is providedoutside the light emitting device 65, it is necessary to prepare anotherboard (mounting board) to be mounted with the drive circuit 110, a cable(harness) for connecting the light emitting device 65 with the boardmounted with the drive circuit 110, etc.

However, when the drive circuit 110 is mounted on the mounting board 62mounted with the light source portion 62 of the light emitting device 65as in the exemplary embodiment, it is not necessary to prepare the boardto be mounted with the drive circuit 110, or the cable (harness). Thus,it is possible to reduce the size and cost of the image formingapparatus 1.

The exemplary embodiment has been described on the assumption that thethyristors (the transfer thyristors T and the light emitting thyristorsL) are of an anode common type, that is, their anode terminals areconnected to the substrate 80. However, when the polarity of the circuitis changed, the thyristors may be of a cathode common type, that is,their cathode terminals may be connected to the substrate 80.

Further, the exemplary embodiment has been described along aself-scanning light emitting element array (SLED) constituted by thelight emitting thyristors L and the transfer thyristors T. However,other members such as control thyristors, diodes, resistors, etc. may beincluded in addition to the light emitting thyristors L and the transferthyristors T.

In addition, in the exemplary embodiment, the transfer thyristors T areconnected to one another through the coupling diodes Dx. However, othermembers such as resistors which can transmit a change in potential maybe used.

Although the lighting signal φI is supplied for each light emitting chipC in the light emitting device 65, plural light emitting chips C may bearranged so that the lighting signal φI can be supplied to the lightemitting chips C in common.

Although the light emitting elements are light emitting thyristors inthe exemplary embodiment, the light emitting elements may be lightemitting diodes (LED) in which a p-type semiconductor layer and ann-type semiconductor layer have been laminated.

What is claimed is:
 1. A print head comprising: a mounting board; alight source portion that comprises a plurality of light emittingelements provided on one surface of the mounting board; a drive memberthat is provided on other surface of the mounting board so as togenerate a lighting signal and drive the light source portion; and afirst temperature detector that is provided on the mounting board, andat least one second temperature detector that is provided at a fartherposition on the mounting board from the drive member than the firsttemperature detector; wherein the drive member comprises: a lightemitting unit that generates the lighting signal based on a temperaturedetected by the first temperature detector and a temperature detected bythe second temperature detector; and an optical unit that forms an imageof light emitted from the light emitting unit.
 2. The print headaccording to claim 1, wherein the drive member generates the lightingsignal using a first correction value that can correct each emissionamount among the plurality of light emitting elements at a predeterminedtemperature, and a second correction value that can correct a change inemission amount caused by temperature.
 3. The print head according toclaim 2, wherein the first temperature detector and the secondtemperature detector are provided on the other surface of the mountingboard and just behind the light source portion provided on the onesurface of the mounting board.
 4. The print head according to claim 3,wherein the drive member provided on the other surface of the mountingboard is provided on the other surface of the mounting boardcorresponding to a longitudinally central portion of the light sourceportion provided on the one surface of the mounting board.
 5. The printhead according to claim 2, wherein the drive member provided on theother surface of the mounting board is provided on the other surface ofthe mounting board corresponding to a longitudinally central portion ofthe light source portion provided on the one surface of the mountingboard.
 6. The print head according to claim 2, wherein the lightemitting unit comprises a nonvolatile memory that can store the firstcorrection value and the second correction value.
 7. The print headaccording to claim 1, wherein the first temperature detector and thesecond temperature detector are provided on the other surface of themounting board and just behind the light source portion provided on theone surface of the mounting board.
 8. The print head according to claim7, wherein the drive member provided on the other surface of themounting board is provided on the other surface of the mounting boardcorresponding to a longitudinally central portion of the light sourceportion provided on the one surface of the mounting board.
 9. The printhead according to claim 1, wherein the drive member provided on theother surface of the mounting board is provided on the other surface ofthe mounting board corresponding to a longitudinally central portion ofthe light source portion provided on the one surface of the mountingboard.
 10. An image forming apparatus comprising: an image holder; acharging unit that charges the image holder; a light emitting devicethat comprises a mounting board, a light source portion that comprises aplurality of light emitting elements provided on one surface of themounting board, a drive member that is provided on other surface of themounting board so as to generate a lighting signal and drive the lightsource portion, a first temperature detector that is provided on themounting board, and at least one second temperature detector that isprovided at a farther position on the mounting board from the drivemember than the first temperature detector, the drive member comprisinga light emitting unit that generates the lighting signal based on atemperature detected by the first temperature detector and a temperaturedetected by the second temperature detector; an exposure unit by whichthe image holder charged by the charging unit is exposed to lightemitted from the light emitting device through an optical unit; adeveloping unit that develops an electrostatic latent image formed onthe image holder exposed by the exposure unit; and a transfer unit bywhich an image developed on the image holder is transferred onto a bodyto be transferred.